Packaging Engineering Manager

Change the world. Love your job.

The Emerging Packaging and Test Team at Texas Instruments is looking for a qualified candidate 

• To lead a high-performing team of packaging technologists to define, design, develop and scale to volume production high voltage (200-3300V) packages and high power modules for the Industrial, Automotive, Renewable and Telecom markets.
• The candidate must understand market trends & end equipment system requirements and build these into competitive forward-looking package and module roadmaps 
• The candidate must have the ability to define solutions across various HV technologies like GaN, SiC, IGBT and Isolation Technologies and validate these using CFD, thermomechanical and electrical parasitic extraction tools.
• The candidate will identify prototype/subcon partners, assess manufacturing capabilities and drive completion of 1^st article builds. The candidate must also be capable of developing new process flows/technologies necessary for scaling to high volume manufacturing 
• The candidate should outline the package reliability plans, complete testing, summarize failure modes and provide solutions to address issues.
• The candidate must have a broad knowledge of the material supplier landscape (mold compounds, die attach, substrates) for high voltage applications as well as  process / equipment integration and must work with various suppliers to provide solutions to meet TI roadmaps 
• The candidate must be a proven leader and people manager, capable working collaboratively across worldwide cross functional teams and capable of accelerating development cycles and ensuring rapid time-to market for new products.