Process Engineering Director

Job Description

We are seeking an experienced and strategic Director of Semiconductor IC Packaging Assembly Operations to lead high-volume semiconductor assembly operations for advanced packaging technologies. This role is accountable for converting qualified package technologies and NPI programs into predictable, scalable manufacturing execution that achieves production output, customer commit dates, and revenue targets. The scope includes AI/data center infrastructure power packaging applications, especially Smart Power Stages, Vertical Power Stages, Power Modules, and Discrete FET packages, with additional scope spanning wide-bandgap (WBG) technologies including SiC and GaN, DBC and AMB substrates, and advanced interconnect technologies. This leader will oversee assembly line readiness, manufacturing execution, capacity utilization, cycle time, yield performance, quality control, process change management, and ramp readiness while partnering closely with Package Engineering, Product Engineering, Quality, Supply Chain Management, Planning, Procurement, and external OSAT partners.

The ideal candidate combines deep semiconductor assembly operations expertise with strong manufacturing leadership, data-driven execution, and cross-functional collaboration skills to drive factory performance, product quality, delivery reliability, and continuous improvement across global operations. This role also serves as a critical interface to Package Engineering and Supply Chain Management by ensuring package development intent, qualification requirements, equipment capacity plans, material readiness, bill of material readiness, and production ramp requirements are translated into stable, cost-competitive, high-volume assembly output.

Key Responsibilities:

Semiconductor Assembly Operations Leadership

• Lead semiconductor package assembly operations across global product lines and manufacturing partners.
• Drive daily, weekly, and quarterly execution to achieve production output, customer delivery commitments, and revenue targets.
• Manage assembly capacity, throughput, cycle time, yield, labor utilization, equipment utilization, and operational cost performance.
• Establish operating mechanisms for production reviews, bottleneck resolution, escalation management, and factory performance tracking.
• Partner with Package Engineering, Product Engineering, Quality, Supply Chain Management, Planning, Procurement, and OSAT teams to ensure manufacturable designs, qualified processes, and robust production controls.

Production Output, Yield & Continuous Improvement

• Own assembly output performance, yield monitoring, trend analysis, and corrective action processes.
• Lead data-driven improvement initiatives to increase line output, reduce bottlenecks, improve first-pass yield, and shorten cycle time.
• Resolve process, equipment, material, reliability, and customer quality issues through disciplined root-cause analysis.
• Define KPIs and dashboards to track production output, revenue-supporting shipments, manufacturing performance, and operational effectiveness.

Quality & Reliability Management

• Partner with Quality and Reliability teams to meet internal, industry, and customer standards.
• Drive containment, corrective, and preventive actions for manufacturing and field quality issues.
• Ensure process controls and qualification requirements are maintained across OSAT sites.
• Support customer, supplier, and internal quality audits and reviews.
• Work with manufacturing partners to resolve issues early and ensure shipment of qualified products.

Process Change Management

• Lead process change management for materials, equipment, tooling, flows, and sites.
• Assess engineering changes for technical, quality, reliability, supply, and operational impact.
• Lead qualification plans for transfers, second sourcing, equipment changes, and cost reductions.
• Maintain disciplined documentation, change control, and manufacturing readiness processes.

NPI Ramp Readiness & High-Volume Manufacturing Execution

• Serve as the key assembly operations interface for NPI-to-production transfers and high-volume ramp execution.
• Partner with Supply Chain Management, Planning, Procurement, Package Engineering, Product Engineering, Quality, and OSAT partners to establish NPI ramp readiness plans.
• Drive equipment capacity planning, bottleneck analysis, tooling readiness, labor readiness, and production line loading plans to support committed ramp schedules.
• Ensure bill of material readiness, qualified material availability, second-source plans, supplier delivery alignment, and material risk mitigation before production ramp.
• Lead manufacturing readiness, process optimization, capacity release, and structured ramp execution for new products.
• Ensure process, qualification, material, site, equipment capacity, and production control readiness for high-volume ramp.

OSAT Operations & Supply Chain Partner Management

• Manage global OSAT and contract manufacturing relationships supporting development, ramp, and production output.
• Drive partner accountability for production output, yield, quality, cycle time, reliability, capacity, and shipment execution.
• Lead operational reviews, technical reviews, audits, benchmarking, and qualification assessments for manufacturing partners.
• Collaborate with Supply Chain Management, suppliers, and OSAT partners on capacity expansion, material readiness, transfers, optimization, scaling, and cost improvement.

Team Leadership & Organizational Development

• Build and develop a high-performing global assembly engineering team.
• Foster a culture of accountability, collaboration, technical excellence, and continuous improvement.
• Support organizational scaling to meet evolving business and technology needs.
• Drive talent development, succession planning, and technical capability growth.
• Strengthen organizational expertise in packaging innovation to support business growth and customer adoption.

Qualifications

Required Qualifications:

• Bachelor’s degree in Electrical Engineering, Materials Science, Mechanical Engineering, Industrial Engineering, Operations Management, Supply Chain, or related technical discipline.
• 12+ years of semiconductor manufacturing, packaging, or assembly operations experience with significant exposure to IC assembly operations, production ramp, capacity planning, package qualification, and NPI-to-HVM transfers.
• 5+ years of leadership experience managing manufacturing, operations, engineering, or cross-functional teams in semiconductor manufacturing environments.
• Strong expertise in semiconductor package assembly processes including wirebond, flip chip, wafer-level packaging, multi-chip modules, molding, singulation, SMT, and advanced packaging technologies; experience with power packaging, power SiP/modules, Smart Power Stages, Vertical Power Stages, Power Modules, Discrete FET packages, power devices, and wide-bandgap packaging such as SiC and GaN is highly valued. Knowledge of DBC, AMB, and advanced interconnect technologies is a strong plus.
• Deep understanding of semiconductor manufacturing yield analysis, SPC, DOE, reliability, process control methodologies, package/process qualification methods, and statistical analysis tools.
• Experience working with global OSAT partners and outsourced manufacturing ecosystems, including benchmarking, selection, qualification, and ongoing technical management of subcontractors and contract manufacturers.
• Proven track record of successful NPI-to-HVM product ramp execution, including equipment capacity planning, material readiness, bill of material readiness, and production output delivery.
• Demonstrated ability to partner with Supply Chain Management, Planning, Procurement, and OSAT partners to align capacity, materials, schedules, and shipment execution to business revenue targets.
• Strong knowledge of semiconductor quality systems, change management, and qualification methodologies.
• Excellent analytical, organizational, communication, and cross-functional leadership skills.

Preferred Qualifications:

• Master’s degree or PhD in Engineering or related field.
• Experience with advanced packaging technologies such as 2.5D/3D packaging, SiP, fan-out, embedded die, heterogeneous integration, wafer-level packaging, multi-chip modules, advanced interconnects, and substrate technologies such as DBC and AMB.
• Familiarity with automotive, AI/data center infrastructure power, high-performance computing, power semiconductor, and wide-bandgap product manufacturing requirements.
• Experience managing geographically distributed engineering teams and global manufacturing operations.
• Knowledge of reliability standards including JEDEC, IPC, and customer qualification requirements.

Additional Information

Renesas is an embedded semiconductor solution provider driven by its Purpose, To Make Our Lives Easier. With a global team of over 21,000 engineers and problem solvers in more than 30 countries, we offer the opportunity to work on world‑leading technology for Automotive, Industrial, Infrastructure, and IoT, shaping a safer, healthier, greener, and smarter future.

At Renesas, TAGIE is our culture, grounded in being Transparent, Agile, Global, Innovative, and Entrepreneurial. It shapes how we work, grow and deliver on our purpose together. This collaborative spirit and mindset drive our semiconductor technology to transform industries and impact millions of lives.

We believe in rewarding our employees with a competitive benefits package alongside their salary. More information will be provided during the hiring process.

Are you ready to join our team and shape the future with us?

Renesas Electronics is an equal opportunity and affirmative action employer, committed to supporting diversity and fostering a work environment free of discrimination on the basis of sex, race, religion, national origin, gender, gender identity, gender expression, age, sexual orientation, military status, veteran status, or any other basis protected by law. For more information, please read our Diversity & Inclusion Statement.