Renesas is one of the top global semiconductor companies in the world. We strive to develop a safer, healthier, greener, and smarter world, and our goal is to make every endpoint intelligent by offering product solutions in the automotive, industrial, infrastructure and IoT markets. Our robust product portfolio includes world leading MCUs, SoCs, Analog and power products, plus Winning Combination solutions that curate these complementary products. We are a key supplier to the world’s leading manufacturers of electronics you rely on every day; you may not see our products, but they are all around you.
Renesas employs roughly 21,000 people in more than 30 countries worldwide. As a global team, our employees actively embody the Renesas Culture, our guiding principles based on five key elements: Transparent, Agile, Global, Innovative, and Entrepreneurial. Renesas believes in, and has a commitment to, diversity and inclusion, with initiatives and a leadership team dedicated to its resources and values. At Renesas, we want to build a sustainable future where technology helps make our lives easier. Join us and build your future by being part of what’s next in electronics and the world.
We are looking for an experienced leader for high performance SOCs/MCUs, for board and packaging group.
Essential Functions:
Minimum Requirements:
MTech/BTech in EC/ EE/CS with hardware engineering experience of 7 to 10 years.
Experience in Microcontroller and Microprocessor based complex design
Experience in latest packaging Technologies and Manufacturing process
Strong domain knowledge of system clocking, system modes, power management, debug
Additional Preferred Qualifications:
Board level System architecture and design includes memory or communication interfaces.
SOC specifications and board level system specifications.
Development and design of SOC power supply, system power supply specifications, and PMIC specifications.
Interface specifications incorporating SOC-peripheral devices
Experience with high-speed interface i.e. PCIe Gen3/4/5/, LPDDR 4/4x/5/5x, UFS, Ethernet, Flash memory
Board level DC/AC simulations.
Schematic, Layout and BOM generation using modern CAD tools
Experience with SoC Bring-up activities
Familiarity with PCB technologies, DFM, DFA, materials, stackup design, assembly rules and manufacturing process
Experience with tools: Ansys HFSS or Cadence SI/PI, or other SI/PI, Cadence APD (Allegro Package Designer) for IC package layout design, SIwave, HSPICE, ADS, Q3D
Experience in IC packaging layout design, emphasizing advanced technologies like SiP (System-in-Package), flip-chip, and 3D packaging.
Comprehensive knowledge of packaging design aspects, encompassing power distribution, thermal control, and signal fidelity. Thermal simulation experience is added advantage.
Profound understanding of semiconductor manufacturing methodologies and packaging assembly processes
Ability to automate the SI, PI and Packaging activities using scripting tools like Python, TCL
Renesas is an embedded semiconductor solution provider driven by its Purpose ‘To Make Our Lives Easier.’ As the industry’s leading expert in embedded processing with unmatched quality and system-level know-how, we have evolved to provide scalable and comprehensive semiconductor solutions for automotive, industrial, infrastructure, and IoT industries based on the broadest product portfolio, including High Performance Computing, Embedded Processing, Analog & Connectivity, and Power.
With a diverse team of over 21,000 professionals in more than 30 countries, we continue to expand our boundaries to offer enhanced user experiences through digitalization and usher into a new era of innovation. We design and develop sustainable, power-efficient solutions today that help people and communities thrive tomorrow, ‘To Make Our Lives Easier.’
At Renesas, you can:
Are you ready to own your success and make your mark?
Join Renesas. Let’s Shape the Future together.
Renesas Electronics is an equal opportunity and affirmative action employer, committed to supporting diversity and fostering a work environment free of discrimination on the basis of sex, race, religion, national origin, gender, gender identity, gender expression, age, sexual orientation, military status, veteran status, or any other basis protected by law. For more information, please read our Diversity & Inclusion Statement.