Senior Chip Assembly Manufacturing Development Engineer
NVIDIANVIDIA is changing the world with its relentless focus on the accelerated computing that has launched the AI revolution. We continue to deliver accelerated computing solutions to ever growing field of applications such Robotics, Autonomous Driving, Genetics, Finance and Professional Visualization. NVIDIA has been transforming computer graphics, PC gaming, and accelerated computing for more than 30 years. We provide an incredible mix of uniquely talented people who provide technology solutions that have a lasting impact. As an NVIDIAN, you’ll be immersed in a diverse, supportive environment where everyone is inspired to do their best work every day. Come join the team and experience the company which is driving the AI revolution.
NVIDIA Operations team is turbocharging our continuous product volume and revenue growth through speed of light execution and creative supply chain/technology solutions. NVIDIA’s Operations team is looking for a Senior Engineer - Chip Assembly Manufacturing Operations. We need someone who has a solid technical background as well as an excellent reputation with our manufacturing partners. You will be reporting to Director of IC Supply Chain and Manufacturing.
What You Will Be Doing:
Bring new products and new technologies to high volume manufacturing
Identify chip assembly interactions and implement solutions to resolve quality/yield issues
Drive continuous improvement in manufacturing yield, cycle time and product quality/reliability
Address manufacturing execution and quality issues through systemic solutions
Deliver datamation solutions for enhanced decision making
Manage supplier performance evaluation matrix and keep it updated based on changing business needs
Lead change control through qualification and notification
Lead non-conforming material disposition and problem solving
What We Need To See:
Master’s degree or higher in Engineering or Science with emphasis on Mechanical, Materials Science, Chemical Engineering fields (or equivalent experience)
12+ year validated experience in Flip Chip semiconductor packaging design, process and materials development. Direct experience in advanced assembly technologies such as 2.5D/3D packaging is essential. Photonics packaging experience is a plus
Thorough understanding of chip assembly equipment design --- knowledge of materials, process, substrate/package design in chip assembly operations. Experience with PCB assembly is a plus
Extensive project management and OSAT management experience
Strong statistical analysis skills – ability to use data visualization techniques to deliver decisions
Deep understanding of quality control, statistics process control, gage R&R and DOE techniques
Knowledge of packaging industry and its supply chain
Excellent written and oral communication skills
Widely considered to be one of the technology world’s most desirable employers, NVIDIA offers highly competitive salaries and a comprehensive benefits package.
NVIDIA is committed to fostering a diverse work environment and proud to be an equal opportunity employer. As we highly value diversity in our current and future employees, we do not discriminate (including in our hiring and promotion practices) on the basis of race, religion, color, national origin, gender, gender expression, sexual orientation, age, marital status, veteran status, disability status or any other characteristic protected by law.
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