Fellow, Advanced Packaging

Our vision is to transform how the world uses information to enrich life for all. 

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. 

Fellow, Advanced Packaging 

Role Summary 

The Fellow, Advanced Packaging serves as Micron's apex technical authority for advanced packaging technologies, driving breakthrough innovations that enable world-leading AI-first products and next-generation heterogeneous integration platforms. This role owns the 3-10 year technology roadmap, identifies technology inflection points, and anticipates fundamental barriers to success.  

The Fellow partners with senior leadership to inform corporate packaging strategy, solves the most critical technical challenges, mentors the next generation of packaging technologists, and elevates Micron's global technical leadership in advanced packaging. 

Key Responsibilities 

• Define and own 3–10-year technology roadmap; identify technology inflection points 

• Anticipate and solve long range fundamental technology barriers – interconnect scaling, hybrid bonding yield, thermals, warpage, reliability and defectivity with multi-die complexes 

• Partner with senior leadership and technologists to inform corporate level packaging strategy and investment priorities 

• Breakthrough problem solving for critical technical roadblocks 

• Mentor and develop next generation of advanced packaging technologists 

• Champion a culture of technical rigor, innovation, intellectual curiosity, and decision frameworks 

• Generate high-value IP in advanced interconnect architectures and materials and process innovations 

• Incubate next-generation platform technologies 

Required Qualifications 

• Ph.D. in Materials Science and Engineering, Electrical Engineering, or related technical field required 

• Minimum 15 years of technical experience in advanced semiconductor packaging technologies with demonstrated expertise in processes such as hybrid bonding, 3D integration, heterogeneous integration, and interconnect scaling 

• Proven track record developing and implementing breakthrough packaging technologies from research through high-volume manufacturing 

• Experience defining long-term technology roadmaps and informing corporate-level investment strategy for next-generation packaging platforms 

• Demonstrated ability to mentor and develop technical talent with measurable impact on engineering capability 

• The ability to bridge fundamental research to production implementation is critical. 

• Leadership positions in major professional societies and/or experience as strategic advisor in either the private or public sector is preferred