Package Health Test (Senior/Staff/Principal) Engineer, APTD
MicronOur vision is to transform how the world uses information to enrich life for all.
Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing.
Micron’s vision is to transform how the world uses information to enrich life for all. Join a world-class global team focused on one thing: using our expertise in the relentless pursuit of innovation to enable high value technology driven solutions for customers and partners. The solutions we create help make everything from virtual reality experiences to breakthroughs in supercomputing and artificial intelligence possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can spark the very innovation we are pursuing.
We are currently experiencing a ground-breaking period in artificial intelligence (AI), where AI is anticipated to become an integral component of daily life. This proliferation is being fueled by advances in memory and compute technologies. High bandwidth memory (HBM) is at the forefront of these innovations. Micron’s Advanced Packaging Technology Development (APTD) is responsible to deliver package development for high performance memory products and transfer to manufacturing.
Job Summary
The Package Health Test Engineer will contribute to the development and execution of package health monitoring, simulation, and characterization activities. This role involves hands-on engineering work in DFT, data analysis, and reliability testing to ensure robust packaging solutions.
Key Responsibilities
Develop advanced packaging technology strategies focused on Test architecture, coverage and yield.
Define, validate and optimize test coverage for both wafer and die level processes
Perform electrical characterization and failure analysis of advanced packages including HBM.
Identify the need and co-develop new DFTs with cross-functional teams.
Enhance test fail debugging capabilities to meet probe yield targets.
Contribute to the APTD product roadmap from test architecture perspective.
Co-work with APTD PI for Test Vehicle (TV) validations; probe coverage definition and its readiness for TVs
Co-drive Customer test flow readiness activities with external partners
Qualifications
Bachelor’s or Master’s degree in Electrical Engineering, or related field.
2+ years of experience in semiconductor industry working on complex products, preferably in product, packaging or test engineering.
Experience defining test architectures, coverage, and managing test/probe yield.
Strong knowledge of product testing, test architecture, and packaging fail modes.
Hands-on experience with simulation tools and test equipment, working on package characterization and electrical failure analysis.
Proven problem-solving and multitasking skills.
Proficiency in AI/ML tools, statistics, data analysis and scripting (e.g., Python, MATLAB, JMP).
Excellent written and verbal communication skills.
About Micron Technology, Inc.
We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all. With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience.
To learn more, please visit micron.com/careers
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