Intern - MMP pFA Lab

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Project Title: MMP pFA Lab

Description:
This project will use existing DDR4/DDR5 DIMM cards as the test vehicles, apply a SOCAMM-like underfill approach around targeted DRAM components, and evaluate two complementary depop-enablers: (1) a ~90% underfill-depth perimeter cut around targeted DRAMs, and (2) laser-based precision depop to remove an underfilled DRAM component from the DIMM card.

Scope:
1.Use existing DDR4/DDR5 DIMM cards as test vehicles and define a controlled sample set (card types / targeted DRAM locations / acceptance checks before processing).
2.Work with an AVL vendor to underfill targeted DRAM(s) on the DIMM card to emulate SOCAMM-like “underfilled package” behavior for recovery trials.
3. Evaluate a 90% underfill-depth perimeter cut around targeted DRAM(s) to create a controlled separation boundary intended to improve depop feasibility and reduce collateral risk.
4. Evaluate laser-based component depop on the underfilled DIMM card with the explicit outcome of successfully depopping an underfilled component from the DIMM card.
5. Define evaluation criteria for “successful depop” (example categories you can include in the plan): component condition post-depop, DIMM pad/land condition, collateral impact to neighbors, and readiness for downstream debug/rework.
6.Coordinate external evaluation logistics as needed for supplier/vendor site work supporting underfilled PCBA depop evaluation

Supporting Team:
FA / GEL (overall project execution, sample selection, analysis ownership, readout preparation)

Deliverables:
1. Experiment plan / trial matrix covering: DIMM selection, target DRAM(s), underfill parameters, perimeter cut parameters, laser depop trial conditions, and response variables.
2. Vendor evaluation report for SOCAMM-like underfill on DDR4/DDR5 DIMMs (feasibility + observations), 90% underfill-depth perimeter cut results (repeatability + observed benefits/limitations)
3. Laser-based depop results focused on depop of an underfilled component from the DIMM card (success/fail characterization and main drivers)
4. Clear go/no-go recommendation with a defined “best known method” on de-popping the underfilled DRAM component from the DIMM card (perimeter cut + laser depop strategy)
5. Final internship readout package (executive summary + technical appendix, photos/micrographs as applicable, lessons learned, and next-step proposals)

Stretch Goal:
1. Demonstrate a repeatable, scalable playbook:
DIMM (existing) → targeted underfill → 90% perimeter cut → laser depop → component recovery outcome with defined acceptance criteria
2. Propose a control plan for future reuse: what minimum checks are required before/after each step to safely operationalize the method.

Requirement
Degree in Mechanical / Materials / Electronics / Manufacturing Engineering

About Micron Technology, Inc.

We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all. With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience.

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