Die Attach Manufacturing Engineer- Process & Equiment

Singapore3-7 years

About Lumilens

At Lumilens, we are building the critical photonics infrastructure powering tomorrow’s AI supercomputing. Our mission is to unlock a new era of computing that is faster, cooler, and massively more efficient. Join our world-class team as we redefine possibilities in photonic technology.

Job Description

We are seeking a Die Attach Manufacturing Engineer – Process & Equipment (Silicon Photonics / PIC Packaging) to join our Manufacturing Engineering team within Photonic Packaging & Assembly. In this mid-to-senior level role, you will lead the development, qualification, optimization, and sustaining of die attach processes and equipment for Photonic Integrated Circuits (PICs), silicon photonics dies, and co-packaged optical/electronic modules. This position is responsible for achieving sub-micron placement accuracy and optical-grade attach quality through active/passive alignment die bonding, epoxy/adhesive dispense, eutectic/AuSn solder attach, and flip-chip bonding. You will ensure high optical coupling yield, mechanical/thermal reliability, and operational throughput, while supporting New Product Introduction (NPI) for emerging photonic packages and modules.

Key Responsibilities

Process Engineering

Develop, characterize, qualify, and optimize die attach processes for PIC/silicon photonics dies, laser dies, and EIC-PIC hybrid assemblies, including active/passive alignment epoxy attach, AuSn/eutectic solder attach, and flip-chip bonding.
Establish and maintain process specifications, work instructions, control plans, and process windows (DOE-based) for sub-micron and low-single-digit-micron placement accuracy.
Lead root cause analysis and implement corrective/preventive actions (CAPA) for die attach-related yield loss and photonics-specific defects (e.g., optical misalignment, coupling loss, epoxy outgassing, die tilt, voids, bond-line thickness control).
Support NPI by developing die attach process flows for new photonic packages, transceiver modules, and hybrid/co-packaged integration platforms.
Monitor SPC/process capability (Cpk) data on placement accuracy, bond-line thickness, and optical coupling efficiency. Drive process improvements to reduce variation and coupling loss.
Evaluate and qualify optically-compatible die attach materials (low-outgassing/UV-cure epoxies, index-matched adhesives, AuSn solder) with Materials and Optical Design Engineering.
Partner with Quality, Reliability, and Product/Optical Engineering on failure analysis and reliability testing (thermal cycling, humidity, optical power/coupling loss, hermeticity, shear/pull testing, X-ray/CSAM/SAT inspection).
Support development of active alignment processes with real-time optical feedback during die bonding.

Equipment Engineering

Own equipment performance, uptime, and OEE for photonics die attach tools (high-precision active/passive alignment die bonders, sub-micron pick-and-place, epoxy dispense, AuSn/eutectic die bonders, UV-cure stations, fiber/waveguide alignment).
Lead equipment installation, qualification (IQ/OQ/PQ), and ramp-up for new/upgraded photonic die bonding and alignment tools, including vision systems and sub-micron motion stages.
Maintain and execute preventive maintenance plans, troubleshoot high-precision optical/mechanical equipment (stage drift, calibration, repeatability), and minimize downtime.
Work with specialized vendors (Besi, Palomar Technologies, Finetech, Set North America, PI/Physik Instrumente, or similar) for tool upgrades, retrofits, spare parts, and technical escalations.
Drive automation, tooling, and fixture improvements for throughput and repeatability while maintaining alignment tolerances and protecting optical facets/lenses.
Support equipment capacity planning and capital equipment (CAPEX) proposals.

Cross-Functional Collaboration

Collaborate with Design, Product, Quality, and Operations teams to align die attach process capability with product requirements.
Provide technical training and guidance to manufacturing technicians and operators.
Support process/equipment documentation for internal and customer audits.
Track and report KPIs: yield, Cpk, equipment uptime, scrap rate, and cycle time.
Engage in cost reduction, lean manufacturing, and Six Sigma/continuous improvement initiatives.

Requirements

Required

Bachelor’s degree in Electrical, Mechanical, Materials, Optical/Photonics Engineering, or related field (Master's preferred for senior roles)
3–7 years of hands-on experience in silicon photonics/PIC industry, focusing on die attach process/equipment engineering for optical or opto-electronic packaging
Direct experience with silicon photonics dies and/or III-V laser dies including wafer/die handling, dicing, facet protection, and optically sensitive die placement
Working knowledge of die attach materials/methods for photonics (low-outgassing/optical-grade epoxies, UV-cure adhesives, AuSn/eutectic solder attach, flip-chip bonding) and failure modes (coupling loss, epoxy haze, bond-line drift, facet damage)
Experience with high-precision die/fiber attach equipment (Besi, Palomar Technologies, Finetech, Set North America, PI/Physik Instrumente, or equivalent)
Familiarity with DOE, SPC, Cpk analysis, and structured problem-solving (8D, 5-Why, Fishbone) for optical coupling yield and alignment accuracy
Understanding of photonic packaging architectures (transceiver modules, co-packaged optics/CPO, hybrid/heterogeneous integration) and their die attach/alignment needs
Strong analytical, troubleshooting, and data-driven decision-making skills at sub-micron/micron-level tolerances
Ability to read/interpret optical/mechanical engineering drawings, specs, and manuals

Preferred

Experience in high-volume silicon photonics, optical transceiver, or PIC foundry/packaging house
Exposure to active alignment and optical feedback-based die bonding (real-time power monitoring)
Experience with hermetic packaging, TECs, and laser die attach for telecom/datacom optics
Six Sigma Green/Black Belt certification
Experience with statistical software (Minitab, JMP) and MES/data systems
Familiarity with automation/robotics for sub-micron precision assembly
Cleanroom manufacturing experience

Skills & Competencies

Strong problem-solving and root cause analysis mindset
Hands-on, equipment-floor-ready with willingness to work on production lines
Effective cross-functional communication and documentation skills
Project management to drive NPI timelines and equipment installs
Comfortable in a fast-paced, metrics-driven manufacturing environment
Ability to work flexible shifts or support production as needed

Physical/Work Environment

Cleanroom/manufacturing floor environment; gowning may be required
Ability to stand for extended periods and work near production equipment
Occasional travel to supplier/equipment vendor sites for tool evaluation/training