As a Packaging Equipment Development Manager, you will drive innovation and excellence in semiconductor packaging processes, equipment and technologies within Intel's dynamic assembly environment. In this role, you will oversee new equipment introductions, ensure seamless integration of equipment and processes, and lead your team in solving complex challenges to deliver world-class manufacturing solutions. Your leadership will directly impact Intel's ability to deliver cutting-edge products to customers, shaping the future of semiconductor technology.

You will be part of Intel's Assembly Technology Development (ATD) organization, which plays a pivotal role in advancing assembly capabilities. This group focuses on developing industry-leading packaging solutions to support Intel's product roadmap, fostering innovation, optimizing manufacturing equipment, and enabling high-volume production. By joining this team, you will contribute to Intel's mission of delivering transformative technologies that fuel global progress

Key Responsibilities

• Lead a team responsible for equipment development, driving innovative solutions for semiconductor packaging.

• Drive first of kind equipment introduction, development and ensure smooth transitions between development and high-volume manufacturing (HVM).

• Manage strategic and tactical decision-making for module engineering activities, ensuring alignment with Intel's operational goals.

• Collaborate with internal and external stakeholders, including manufacturing, automation, equipment suppliers, and process integration teams, to optimize equipment, processes and solve technical challenges.

• Develop long-term strategies for equipment capabilities to support future requirements.

• Provide mentorship to engineers, fostering technical expertise and leadership within the team.

• Ensure team accountability and drive results through effective goal setting, performance management, and collaboration.

• Champion Intel's values, creating an inclusive and productive work environment.

Minimum Qualifications

• Bachelor's degree in Materials Science, Mechanical Engineering, Physics, Electrical Engineering, Chemical Engineering or a related field, with 9+ years of relevant experience.

• OR- Master's degree in the above fields with 6+ years of relevant experience.

• OR- PhD degree in the above fields with 4+ years of relevant experience.

• Demonstrated experience in equipment development and process integration for semiconductor packaging.

• Proficiency in statistical methods, experimental design, and data analysis.

Preferred Qualifications

• 5+ years of semiconductor assembly process technology development experience.

• 3+ years of people management experience, including mentoring and team leadership.

• Expertise in dispense, thermal, plasma equipment development, or related fields.

• Strong problem-solving skills and familiarity with assembly equipment development methodologies.

• Ability to create and execute equipment solution roadmaps, guiding external suppliers to develop industry-leading technologies.

Join our innovative team and play a key role in developing cutting-edge solutions that drive the future of semiconductor technology. Your expertise and leadership will help Intel deliver world-class products that shape our industry. Apply today to become a vital part of our journey.