Firmware and Systems Developer Intern 2027 -Poughkeepsie, NY

IBM Hardware and Systems engineers design and deliver the compute platforms that power the world’s most advanced AI, cloud, and enterprise technologies. From silicon to system, our teams collaborate across mechanical, electrical, computer, materials, and firmware engineering to design, develop, prototype, and test next-generation IBM hardware and firmware. We are seeking Hardware, Systems, and Firmware Development Interns to join our U.S. development labs for 2026. These roles provide hands-on experience in firmware development, hardware bring-up, design, prototyping, testing, and process development across IBM’s high-performance systems portfolio.

As an intern, you will: Collaborate across disciplines to design, model, and validate next-generation hardware and firmware. Participate in power electronics development, firmware development, and system bring-up. Conduct experiments, analyze data, and contribute to reliability, process, and materials development projects. Write scripts and automation tools using Python, C/C++, or Bash to support testing and validation. You’ll have opportunities to work in focus areas such as: Electrical & Logic Design – PCB/IC layout (Cadence, Allegro), digital logic, circuit, and system design. Firmware & Automation – Embedded systems, firmware testing, scripting, and hardware debugging. B.S. or M.S. student in Mechanical, Electrical, Computer, Materials, Chemical, Industrial, or related Engineering disciplines. Strong academic background with an interest in hardware design, firmware, optics, logic, process, or materials engineering. Experience with CAD tools (SolidWorks, AutoCAD, Allegro, Cadence) and/or simulation tools (CFD, FEM, HFSS). Programming experience with Python, C/C++, or Bash for firmware, automation, or data analysis. Strong analytical, problem-solving, and teamwork skills. Experience with firmware development, test automation, or embedded systems. Hands-on experience with lab tools (LabVIEW, MATLAB, oscilloscopes, thermal chambers, or optical test equipment). Familiarity with design of experiments (DOE) or project management in a research or lab environment. Experience in signal or power integrity modeling, optical systems, logic design, firmware, or materials process engineering. M.S. or Ph.D. students with a research focus in electrical packaging, photonics, signal integrity, thermal design, or firmware are encouraged to apply. United States Infrastructure & Technology Hybrid Internship POUGHKEEPSIE, US (0147) International Business Machines Corporation