Research Scientist – RF/Mixed-Signal Packaging and Module Design

At IBM Research, we are the innovation engine of IBM. Exploring what’s next in computing and shaping the technologies the world will rely on tomorrow. From advancing AI and hybrid cloud to pioneering practical quantum computing, we anticipate challenges and unlock new opportunities for clients, partners, and society. Working in Research means joining a team that accelerates discovery at the intersection of high-performance computing, AI, quantum, and cloud. You’ll collaborate with leading scientists, engineers, and visionaries to push boundaries and turn ideas into reality. With a culture built on curiosity, creativity, and collaboration, IBM Research offers the opportunity to grow your career while contributing to breakthroughs that transform industries and change the world. IBM Quantum is hiring a Research Scientist to contribute to the development of advanced, high-performance RF and mixed-signal single-chip and multi-chip modules (MCMs) for exploratory applications. We focus on differentiated solutions for a range of communication and computation challenges, including the creation of CMOS-based electronics for quantum computing applications. Successful applicants will have demonstrated experience in the development of complex packaging solutions for RF and mixed-signal functions.

In this role, you may be tasked with designing packages that support RFICs, high-speed digital interfaces, and high-density interconnects. Various substrate technologies can be used for these designs including organic laminates and Si-based interposers. The design process will include EM simulation, package-IC co-simulation, and signal integrity and power integrity analysis (SI/PI).

You will work in close collaboration with IC and system designers and be involved in all aspects of design projects from concept and module architecture exploration/definition to bring up and test; demonstrated hands-on lab skills are therefore important. In addition, background in communication theory and systems and/or quantum computing would be advantageous. Strong background in RF/microwave engineering. Familiarity with state-of-the art packaging technologies. Experience with HFSS, ADS, Cadence Allegro, or similar tools. RF/Mixed-Signal Package Design: A strong foundation and experience in package physical design, EM simulation, and SI/PI. (2 years). Module implementation: Demonstrated expertise through successful implementation of RF, analog, and/or mixed-signal packaging solutions including experimental characterization (2 years). Experience with packaging solution design involving high-density digital interconnects RF and/or digital IC design experience is a plus Programming Skills: Candidates with strong programming skills in commonly used languages Communication and collaboration skills: Excellent verbal and written communication skills are highly valued for effective collaboration within the team. A track record of successful participation in multi-disciplinary research and development projects is a plus. Research skills: Proven record of research accomplishment (e.g. publications) United States Research Professional Yorktown Heights, US (0147) International Business Machines Corporation