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Technical Program Manager, System in Package
AppleShanghai, Shanghai, China
Apply In this highly visible role, you will serve as the operation expert in manufacturing process, yields, and factory readiness for mass production, partnering with a cross-functional team that includes design, supplier quality, test, service, and technical program engineers.
Bring your engineering depth and program leadership to one of the most operationally complex areas at Apple. You will collaborate closely with the New Product Introduction group and our manufacturing partners to drive quality, deliver against tight timelines, and shape how Apple products are built at scale.
The Technical Program Manager assumes total ownership of factory output, yield, quality, and volume-ramp readiness, partnering with cross-functional teams and contract manufacturers to deliver top-quality products on schedule.
- Own end-to-end factory output, yield, quality, and readiness for volume ramp.
- Integrate lessons learned into future designs and apply predictive methods to anticipate quality issues early in the development cycle.
- Maintain open issue lists and drive closure prior to mass production start.
- Partner with manufacturing partners to advance yield and operational excellence through direct engagement, structured communication, and continuous improvement initiatives.
- Track manufacturing-partner performance through objective measurement systems, audits, and on-line verification, and implement corrective action plans across the product life cycle.
- Deliver executive-level status reports on a weekly cadence.
- Escalate key concerns and resolution options to senior management.
- Bachelor's degree in Engineering or equivalent.
- Excellent written and spoken English communication skills.
- Experience in high-volume consumer-electronics manufacturing with SMT and packaging process.
- Operation management experience including yield improvement and OEE optimization.
- Working knowledge of quality-control methodologies including SPC, MSA, GRR, FMEA.
- Program or project management experience with a demonstrated ability to translate high-level goals into actionable plans.
- Experience operating within a matrix organization and leading cross-functional teams across cultures.
- Master's degree in Engineering or equivalent.
- Demonstrated technical expertise in PCBA, molding, laser processing, sputtering, assembly, test, and pack-out processes.
- Hands-on experience with design of experiments (DOE) and failure analysis (FA), with the ability to solve problems under pressure using data-driven methods.
- Familiar with automation and DFM design for semiconductor packaging operation.
- Background in electrical engineering through education or work experience.
- Familiarity with electrical and mechanical product inspections.