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Process Development Engineer ( Precision Bonding )
AppleYokohama, Kanagawa-ken, Japan3+ years
Apply We bring amazing people together to make amazing things happen.
We’re a diverse collective of thinkers and doers, continuously reimagining our products and practices to help people do what they love in new ways. That innovation is inspired by a shared commitment to great work — and to each other. Because learning from the people here means we’re learning from the best.
The Camera Hardware Engineering group is responsible for the development of key technology for Apple products.
We are seeking an energetic and highly motivated bonding process engineer to work on advanced optical technology development.
Will you help us create the next generation of revolutionary Apple products?
You will lead the development and improvement of sub-micron order precision assembly processes, especially adhesive bonding and thermal compression bonding techniques for plastic materials, to realize new designs aimed at enhancing our product quality and performance. We are looking for individuals who can leverage cutting-edge technology and expertise to contribute to strengthening our competitive edge through innovative process development.
You will drive our precision process development, focusing on the following areas:
New Process Development:
Research and development, and establishment of elemental technologies for processes such as sub-micron order micro-component assembly, and adhesive bonding (e.g., UV curing, thermal curing) and thermal compression bonding (e.g., ultrasonic welding, laser welding, hot plate welding) techniques for plastic materials. This includes designing jigs and tools necessary for process development, optimization, and efficient process establishment as well as building test environments, either independently or in collaboration with relevant departments.
Evaluation, Analysis & Failure Analysis:
Conducting evaluations of bonded joint strength, durability, and reliability. Performing root cause analysis, identifying fundamental causes, and implementing countermeasures for failures occurring in manufacturing processes.
- 3+ years of practical experience in thermal bonding technologies, or an equivalent level of proficiency.
- Practical experience in operating sub-micron high-precision assembly and bonding equipment.
- Design of jigs and tools using 3D-CAD.
- Technical documentation: Creation of development reports, Standard Operating Procedures (SOPs), etc.
- Bachelor's degree or higher in Engineering or Science, or an equivalent level of capability.
- Strong ability to think logically in response to highly challenging requirements, work autonomously, communicate smoothly with stakeholders including global teams, and embrace challenges.
- Planning and execution of development plans.
- Experience in developing high-precision assembly and bonding equipment.
- Beneficial if the candidate also had FEA experience.
- Data Analysis & Evaluation: Data acquisition using Design of Experiments (DOE), statistical analysis of results, and factor analysis.
- Adaptation of developed processes to mass production.
- Knowledge of chemistry for analyzing bonding conditions/states.
- Individuals who have experience in or are capable of technical development from fundamental principles.
- Japanese reading, writing, and conversational skills.
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