Advanced Package Development Engineer

Austin, Texas, United States10+ years

Join the team behind the technology in a billion pockets worldwide. Apple's Advanced Packaging Program is seeking engineers to drive package integration and technology development for next-generation products. In this role, you'll contribute to the advanced packaging technologies that enable Apple's industry-leading silicon performance. You'll work alongside world-class engineers to solve complex integration challenges and bring new packaging innovations from concept to mass production.

Developing advanced packaging technologies in a cross-functional team. You will be responsible for Package integration and technology development. We're looking for someone who: • Has deep expertise in semiconductor packaging or related disciplines • Thrives on solving difficult technical problems • Holds themselves to a high standard of engineering excellence • Is self-motivated and comfortable navigating ambiguity

Develop and qualify advanced packaging technologies including substrate design, interconnect architectures, and assembly processes to meet performance, power, and form factor requirements for next-generation products.
Drive package integration across silicon, firmware, and system teams to ensure co-optimization of die architecture, package design, and thermal/mechanical constraints.
Lead characterization and failure analysis efforts to identify root causes of reliability or performance issues and implement corrective actions.
Partner with external suppliers and foundries to evaluate new materials and processes, establish specifications, and enable technology transfer to high-volume manufacturing.
Define and execute test vehicles and experiments to validate packaging concepts, establish design rules, and generate data for product design decisions.

BS and 10+ years of experience in relevant industry experience.

PhD and 6+ years of experience in relevant industry preferred.
Silicon fab interconnect process integration experience in BEoL process, RDL, fine pitch μ-bumps, hybrid bonds, TSVs, etc.
Deep knowledge of electrical, mechanical and thermal properties of fab materials.
Strong expertise in Si Fab equipment and Fab Logistics Management.
Experience on advanced packaging for groundbreaking CMOS nodes.
Expertise on Si structure yield and reliability mechanisms and analyses.
Good familiarity with electrical, mechanical and/or thermal characterization, failure analysis.
Tool experience: One or more of TCAD, JMP, Virtuoso, KLayout, Ansys EDT.
Capable of independent R&D Work in a cross-functional team, driving vendors.
Excellent communication skills.
Experience in Si fab integration role and advanced packaging.

Apple is an equal opportunity employer that is committed to inclusion and diversity. We seek to promote equal opportunity for all applicants without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or other legally protected characteristics. Learn more about your EEO rights as an applicant

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Apple accepts applications to this posting on an ongoing basis.

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